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3D Design, Test and Inspection
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There is a natural progression that emerging technologies follow as they make their way from the drawing board to market adoption and volume production. As such, each sector of the supply chain is called to action at different stages along that technology’s evolution. At each bend in the road, the emerging technology becomes a driver for process development, next-generation manufacturing tools, new materials, design tools, inspection tools, test, measurement and reliability methodologies, etc. Read More>> |
There’s no doubt about it, IMEC’s 3D TSV technology's march towards maturity is picking up speed. At last week’s technology forum, Pol Marchal, principal scientist of IMEC’s 3D-SoC design initiative, gave us an update on progress since last year, analogizing the evolution with raising a leopard cub from baby to adulthood – or as he titled his presentation, “Growing up from Baby to Killer Technology.”
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Although it appears to those developing 3D IC integration processes that the design community hasn’t been heeding the call for the much needed design tools, after talking with Lisa McIlrath of R3 Logic, I realized there’s a lot more to it than that. In fact, the message has been heard, but these things are more convoluted than we think. In fact, it's a bit of a cart-before-the-horse situation. How can design tools be developed until the process technologies, characterization, and paramaters have been determined, and prototypes tested? Read More>> |
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3D Design, Test and Inspection
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